Solder Paste, Electronic Soldering Paste with Flux, Sn64 Bi35 Ag1 Lead-free SMD Solder Paste for PCB IC SMD LED BGA QFN SMT electronics (1.23oz/35g)

Price: $9.99
(as of Aug 04, 2024 06:42:20 UTC – Details)

Product Description

BEEYUIHF SMD Solder Paste – Lead-free Sn64 Bi35 Ag1 Soldering Paste #9300

183℃ (361F) Melting Point – Medium temperature tin is often used for maintenance of electronic products. Its alloy components are tin, silver, bismuth, etc., and the particle size of tin powder is between 25 microns and 45 microns. Fine and smooth paste with fluxes, essential welding repair tools.

BEEYUIHF Composition of the lead free soldering paste: Sn:64%, Bi:35%, Ag:1%

BEEYUIHF Lead-free SMD solder paste – Medium temperature electronics solder paste with flux, Melting point: 183°C (361F); Particle size: #4 (25-45 microns); Storage temperature: 0-10℃; Gross weight: 10cc/35g; Packaging method: 10CC Syringe solder paste.

Ag 1% Solder paste to improve wettability, joint strength and fatigue resistance

Suitable for wireless network card, DVD, cell phones, refrigerators, air conditioners, high-frequency head, security products, computers, CPU, IC chips, computer motherboards, automobiles and other high-end electronic products SMT process.

Electronic soldering paste suitable for SMD QFN LED PCB SMT BGA IC soldering

#9300 soldering paste Mainly used in the SMT industry for PCB surface electronic components welding repair, BGA chip tinning, wiring soldering, SMD soldering, cell phone repair and so on.

LED welding & high frequency welding & LED PCB BGA CPU SMT rework tools. High wettability

Automatic homing, solid and simple soldering of IC chips, solder paste specialized for IC and small components soldering.

finesse solder paste

Low temperature solder paste, low soldering temperature, soldering process will not affect other components.

Firmly welded

With just a little solder paste, you can use a hot air gun to solder plugs and terminals securely, making it easy to operate and solder securely.

Lower temperatures

The lower soldering temperature is ideal for components that cannot withstand high temperatures, such as LEDs, ICs, or precision components.

Lead-free solder paste, Solder joints are firm and bright, even and full

Low residue, No clean solder paste, R & D preparation of no-clean flux, less residue after welding, high insulation impedance, the board surface is clean and non-corrosive, and the formation of a protective layer to prevent the re-oxidation of the substrate.

BEEYUIHF solder paste flux different styles:

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Customer Reviews

4.5 out of 5 stars
34

4.7 out of 5 stars
33

4.7 out of 5 stars
80

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33

4.5 out of 5 stars
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4.2 out of 5 stars
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Price

$8.99$8.99

$9.99$9.99

$6.99$6.99

$9.99$9.99

$9.99$9.99

$12.99$12.99

$6.99$6.99

Model

#8300

#9300

#8403

#9530-30mL

#8150

#9530

#7150

Gross weight

1.05oz/30g

1.23oz/35g

20g

30mL

100g

146g

65g

Material

Sn42 Bi58

Sn64 Bi35 Ag1

flux

flux

flux

flux and rosin

rosin

Product Status

paste

paste

good mobility paste

paste

paste

paste

paste

features

138℃ Low Temp

183℃ Medium Temp

No clean, moderate viscosity

No clean, deoxidation

No clean, deoxidation

No clean, no residue

Bright and full solder joints

Welding temperature

250~320℃（482℉~608℉)

300~350℃（572℉~662℉)

250~320℃（482℉~608℉)

250~320℃（482℉~608℉)

250~320℃（482℉~608℉)

250~320℃（482℉~608℉)

250~320℃（482℉~608℉)

Storage temperature

2~10 °C（35℉~50℉)

2~10 °C（35℉~50℉)

normal temperature storage

normal temperature storage

normal temperature storage

normal temperature storage

normal temperature storage

Scope of Application

for Electronics LED PCB BGA

for PCB IC SMD LED BGA QFN SMT

for PCB/IC/BGA/SMD soldering

for PCB/IC/BGA/SMD soldering

for PCB/IC/BGA/SMD soldering

for PCB/IC/BGA/SMD soldering

for PCB/SMT/SMD soldering

packaging

10CC syringe

10CC syringe

10CC syringe

30CC syringe

aluminum box

Plastic cans

Iron box

BEEYUIHF #9300 solder paste need to set the temperature of the hot air gun: lead-free solder paste has a low melting point, melting point of 183 degrees, when soldering the hot air gun can be adjusted to 300~350 ℃ (572 ℉~662 ℉) after preheating the PCB first.
Alloy composition of solder paste Sn64 Bi35 Ag1: 1% silver content, firmness, conductivity, better gloss, fine viscosity, excellent wettability, does not produce tin beads, very suitable for conventional mobile phone/CPU/IC repair and soldering.
SMT processing products the more difficult, the more important the choice of solder paste. #9300 lead-free solder paste, the cream is delicate, point coating uniformity, with excellent electrical properties, in the 0.3mm pitch tiny pads, are able to show excellent and stable printing performance, improve the quality of welding.
Silver-containing lead-free medium temperature solder paste: solid solder joints, no bubbles, no cracks, smooth, bright, full. This model has increased granularity and dramatically improved conductivity without a single false solder.
#9300 soldering paste Mainly used in the SMT industry for PCB surface electronic components welding repair, BGA chip tinning, wiring soldering, SMD soldering, cell phone repair and so on.
How to store the solder paste: Quality guarantee period: 1 year, storage temperature 2~10 °C (35°F~50°F), can be stored for more than one year at room temperature. If the solder paste is not sealed and preserved resulting in a hard paste, please contact after-sales customer service or replace it.